The effect of annealing temperature on the physical properties of Cu2O thin film deposited by SILAR method
dc.authorid | ERKEN, Ozge/0000-0002-6493-3059 | |
dc.authorid | Ozaslan, Dogan/0000-0001-5947-4663 | |
dc.authorid | Gunes, Mustafa/0000-0002-7974-0540 | |
dc.contributor.author | Ozaslan, D. | |
dc.contributor.author | Erken, O. | |
dc.contributor.author | Gunes, M. | |
dc.contributor.author | Gumus, C. | |
dc.date.accessioned | 2025-01-06T17:37:17Z | |
dc.date.available | 2025-01-06T17:37:17Z | |
dc.date.issued | 2020 | |
dc.description.abstract | Cu2O film was deposited on a glass substrate at 70 degrees C by the SILAR (Successive Ionic Layer Adsorption and Reaction) method. The Cu2O film was annealed in an air atmosphere at 100 degrees C, 300 degrees C, and 500 degrees C temperatures for 1 h and the effect of the annealing temperature on the physical properties was investigated. The phase-transition temperature that corresponds to the transformation from Cu2O to CuO was occurred at temperature of approximately 300 degrees C with annealing process. The energy band gap (E-g) was reduced from 2.57 eV to 1.91 eV with the increasing annealing temperature. Hall measurement revealed that the film showed p-type conductivity and the resistivity (rho) of Cu2O deposited at 70 degrees C and annealed 100 degrees C were calculated as 6.12 x 10(4) and 7.44 x 10(3 )Omega cm, respectively, while the film annealed at 300 degrees C and 500 degrees C the resistivity of CuO was found to be 8.23 x 10(3) and 5.11 x 10(2) Omega em, respectively. | |
dc.description.sponsorship | Cukurova University [FDK-2015-3778] | |
dc.description.sponsorship | This work was supported by Cukurova University under project number FDK-2015-3778. | |
dc.identifier.doi | 10.1016/j.physb.2019.411922 | |
dc.identifier.issn | 0921-4526 | |
dc.identifier.issn | 1873-2135 | |
dc.identifier.scopus | 2-s2.0-85076710148 | |
dc.identifier.scopusquality | Q2 | |
dc.identifier.uri | https://doi.org/10.1016/j.physb.2019.411922 | |
dc.identifier.uri | https://hdl.handle.net/20.500.14669/2183 | |
dc.identifier.volume | 580 | |
dc.identifier.wos | WOS:000510641000029 | |
dc.identifier.wosquality | Q3 | |
dc.indekslendigikaynak | Web of Science | |
dc.indekslendigikaynak | Scopus | |
dc.language.iso | en | |
dc.publisher | Elsevier | |
dc.relation.ispartof | Physica B-Condensed Matter | |
dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | |
dc.rights | info:eu-repo/semantics/closedAccess | |
dc.snmz | KA_20241211 | |
dc.subject | Cu2O | |
dc.subject | Annealing | |
dc.subject | CuO | |
dc.subject | SILAR | |
dc.subject | XRD | |
dc.subject | FE-SEM | |
dc.title | The effect of annealing temperature on the physical properties of Cu2O thin film deposited by SILAR method | |
dc.type | Article |