Heat transfer enhancement of electronic devices by using flexible printed circuit boards

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dc.authoridAljabair, Sattar/0000-0002-0528-8651
dc.contributor.authorEmad, Mustafa
dc.contributor.authorAljabair, Sattar
dc.contributor.authorImran, Ahmed Abdulnabi
dc.date.accessioned2025-01-06T17:37:55Z
dc.date.available2025-01-06T17:37:55Z
dc.date.issued2023
dc.description.abstractIn this paper, heat transfer in electronic equipment was studied numerically and experimentally, by investing in the flexible printed circuit board and changing the board's orientation, which is the substrate of the electronic equipment from a vertical to a horizontal position. ANSYS Fluent software has been used to solve the continuity, momentum, and energy equations with the three-dimensional, unsteady, laminar and incompressible flow. In this study, the oscillatory motion equation was used as a boundary condition to represent the motion of the flexible board. In the experimental aspect of this study, a simulation of an ASUS motherboard (X399-A) with dimensions (30 x 25) cm and a Core i9 CPU with a fully working power of 130W was used to study the enhancement of heat transfer in the electronic devices by test rig specially made for this study. The results show that the flexible board's enhancement in the heat transfer was (7%) vertically and (7.6%) horizontally compared with the rigid board for the same working conditions. The horizontal position is better than the vertical of the two types of rigid and flexible board, with improved heat transfer rates of (2.7%) and (3%); correlation Equations of the Nusselt number from experimental results are presented.
dc.identifier.doi10.18186/thermal.1401009
dc.identifier.endpage1547
dc.identifier.issn2148-7847
dc.identifier.issue6
dc.identifier.scopus2-s2.0-85184265086
dc.identifier.scopusqualityQ3
dc.identifier.startpage1531
dc.identifier.trdizinid1255191
dc.identifier.urihttps://doi.org/10.18186/thermal.1401009
dc.identifier.urihttps://search.trdizin.gov.tr/tr/yayin/detay/1255191
dc.identifier.urihttps://hdl.handle.net/20.500.14669/2417
dc.identifier.volume9
dc.identifier.wosWOS:001122864300002
dc.identifier.wosqualityQ3
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.indekslendigikaynakTR-Dizin
dc.language.isoen
dc.publisherYildiz Technical Univ
dc.relation.ispartofJournal of Thermal Engineering
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/openAccess
dc.snmzKA_20241211
dc.subjectFlexible Printed Circuit Board
dc.subjectSubstrate Board Orientation
dc.subjectElectronics System Cooling
dc.subjectEnhancement Heat Transfer
dc.titleHeat transfer enhancement of electronic devices by using flexible printed circuit boards
dc.typeArticle

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